The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 01, 2019
Filed:
Apr. 10, 2017
City University of Hong Kong, Kowloon, HK;
City University of Hong Kong, Kowloon, HK;
Abstract
Systems and methods which provide an antenna in a chip-and-package distributed configuration as disclosed. Chip-and-package distributed antenna configurations of embodiments comprise an on-chip integrated circuit component and an in-package component. For example, embodiments of a chip-and-package distributed antenna comprise an exciting element on chip (i.e., formed as an integrated component in an integrated circuit die) and a primary radiator in package (i.e., disposed within an package while being external to the integrated circuit die). The on-chip exciting element may be configured to excite electromagnetic waves and to provide relatively wide bandwidth operation while occupying a relatively small area of the die. The in-package primary radiator may be configured to leverage the relatively large space in the integrated circuit product package to enhance the gain and/or configure the radiation pattern of RF signals with respect to the exciting element.