The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 01, 2019

Filed:

Nov. 20, 2017
Applicants:

Tsinghua University, Beijing, CN;

Hon Hai Precision Industry Co., Ltd., New Taipei, TW;

Inventors:

Yu-Jia Huo, Beijing, CN;

Yu-Dan Zhao, Beijing, CN;

Xiao-Yang Xiao, Beijing, CN;

Ying-Cheng Wang, Beijing, CN;

Tian-Fu Zhang, Beijing, CN;

Yuan-Hao Jin, Beijing, CN;

Qun-Qing Li, Beijing, CN;

Shou-Shan Fan, Beijing, CN;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/423 (2006.01); H01L 21/02 (2006.01); H01L 51/00 (2006.01); H01L 29/16 (2006.01); H01L 29/06 (2006.01); H01L 29/24 (2006.01); C08L 67/02 (2006.01); H01L 29/66 (2006.01); H01L 51/05 (2006.01); H01L 29/786 (2006.01);
U.S. Cl.
CPC ...
H01L 29/42384 (2013.01); C08L 67/02 (2013.01); H01L 21/02266 (2013.01); H01L 29/0665 (2013.01); H01L 29/1606 (2013.01); H01L 29/24 (2013.01); H01L 29/66742 (2013.01); H01L 29/78603 (2013.01); H01L 51/0048 (2013.01); H01L 51/0525 (2013.01); H01L 51/0529 (2013.01); C08L 2203/16 (2013.01); H01L 2029/42388 (2013.01); H01L 2251/303 (2013.01);
Abstract

The disclosure relates to a thin film transistor and a method for making the same. The thin film transistor includes a substrate; a semiconductor layer on the substrate, wherein the semiconductor layer includes nano-scaled semiconductor materials; a source and a drain, wherein the source and the drain are on the substrate, spaced apart from each other, and electrically connected to the semiconductor layer; a dielectric layer on the semiconductor layer, wherein the dielectric layer includes a first sub-dielectric layer and a second sub-dielectric layer stacked on one another, and the first sub-dielectric layer is a first oxide dielectric layer grown by magnetron sputtering; and a gate in direct contact with the first sub-dielectric layer. The thin film transistor almost has no current hysteresis.


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