The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 01, 2019

Filed:

Nov. 24, 2016
Applicants:

Boe Technology Group Co., Ltd., Beijing, CN;

Hefei Xinsheng Optoelectronics Technology Co., Ltd., Hefei, CN;

Inventors:

Zhixiang Zou, Beijing, CN;

Chengshao Yang, Beijing, CN;

Botao Song, Beijing, CN;

Yinhu Huang, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/12 (2006.01); H01L 21/02 (2006.01); G02F 1/1343 (2006.01); G02F 1/1368 (2006.01); G02F 1/1333 (2006.01); H01L 27/32 (2006.01); H01L 29/786 (2006.01); H01L 51/05 (2006.01); G02F 1/1362 (2006.01);
U.S. Cl.
CPC ...
H01L 27/1248 (2013.01); H01L 21/0212 (2013.01); H01L 21/0234 (2013.01); H01L 21/02118 (2013.01); H01L 21/02334 (2013.01); H01L 27/1259 (2013.01); H01L 27/1262 (2013.01); G02F 1/1368 (2013.01); G02F 1/13439 (2013.01); G02F 1/133345 (2013.01); G02F 1/136227 (2013.01); G02F 2001/13685 (2013.01); G02F 2001/133357 (2013.01); G02F 2202/02 (2013.01); G02F 2202/10 (2013.01); G02F 2202/103 (2013.01); G02F 2202/104 (2013.01); H01L 27/1222 (2013.01); H01L 27/3258 (2013.01); H01L 27/3262 (2013.01); H01L 27/3274 (2013.01); H01L 29/7869 (2013.01); H01L 29/78666 (2013.01); H01L 29/78669 (2013.01); H01L 29/78675 (2013.01); H01L 29/78678 (2013.01); H01L 51/0541 (2013.01); H01L 51/0545 (2013.01);
Abstract

The present application discloses a method of fabricating a display substrate having an organic layer for reducing parasitic capacitance between electrodes in different layers. The method includes forming the organic layer on a base substrate; subjecting the organic layer to a surface treatment process to descum organic residues from a surface of the organic layer; and forming a passivation layer on a side of the organic layer distal to the base substrate subsequent to subjecting the organic layer to the surface treatment process.


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