The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 01, 2019

Filed:

Feb. 10, 2017
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventors:

Ju Youn Kim, Suwon-si, KR;

Gi Gwan Park, Hwaseong-si, KR;

Assignee:

SAMSUNG ELECTRONICS CO., LTD., Suwon-si, Gyeonggi-Do, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/423 (2006.01); H01L 27/088 (2006.01); H01L 29/49 (2006.01); H01L 21/8234 (2006.01); H01L 29/78 (2006.01); H01L 29/66 (2006.01); H01L 29/08 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0886 (2013.01); H01L 21/82345 (2013.01); H01L 27/088 (2013.01); H01L 29/0847 (2013.01); H01L 29/4966 (2013.01); H01L 29/66545 (2013.01); H01L 29/66795 (2013.01); H01L 29/7851 (2013.01); H01L 29/7854 (2013.01); H01L 29/7856 (2013.01); H01L 21/823456 (2013.01); H01L 2029/7858 (2013.01);
Abstract

A semiconductor device is provided. The semiconductor device includes a substrate including a first region and a second region. First and second dielectric films are positioned above the substrate in the first region and the second region, respectively. First and second gate stacks are disposed on the first and second dielectric films, respectively. The first gate stack includes a first TiAlC film in direct contact with the first dielectric film, and a first barrier film and a first metal film sequentially stacked on the first TiAlC film. The second gate stack includes a first LaO film in direct contact with the second dielectric film. A second TiAlC film, a second barrier film, and a second metal film are sequentially stacked on the first LaO film.


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