The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 01, 2019

Filed:

May. 16, 2018
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventors:

Myeong Woo Han, Suwon-si, KR;

Chan Yong Jeong, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/538 (2006.01); H01L 25/18 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H03H 9/10 (2006.01); H03H 9/17 (2006.01); H03H 9/56 (2006.01); H03H 9/54 (2006.01); H03H 9/70 (2006.01); H01L 27/20 (2006.01); H01L 23/66 (2006.01); H04B 1/40 (2015.01); H03H 9/05 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5389 (2013.01); H01L 23/3128 (2013.01); H01L 23/3135 (2013.01); H01L 23/5383 (2013.01); H01L 23/5384 (2013.01); H01L 23/5385 (2013.01); H01L 23/66 (2013.01); H01L 24/20 (2013.01); H01L 25/18 (2013.01); H01L 27/20 (2013.01); H03H 9/105 (2013.01); H03H 9/173 (2013.01); H03H 9/545 (2013.01); H03H 9/56 (2013.01); H03H 9/703 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/214 (2013.01); H03H 9/0547 (2013.01); H03H 9/1014 (2013.01); H04B 1/40 (2013.01);
Abstract

A fan-out electronic component package includes a core, a first electronic component, a first encapsulant, a connection member, a second electronic component, and a second encapsulant. The core member includes a through-hole, wiring layers and vias configured to electrically connect the wiring layers to each other. The first electronic component is disposed in the through-hole, and comprising filters configured to filter different frequency bands. The first encapsulant covers portions of the core member and the first electronic component, and fills portions of the through-hole. The connection member is disposed on the core member and the first electronic component, and includes a redistribution layer electrically connected to the wiring layers and the first electronic component. The second electronic component is disposed on the connection member and electrically connects to the redistribution layer. The second encapsulant is disposed to cover the second electronic component.


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