The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 01, 2019
Filed:
Nov. 13, 2017
Applicant:
Nuvotronics, Inc, Radford, VA (US);
Inventors:
Jean-Marc Rollin, Radford, VA (US);
David W. Sherrer, Radford, VA (US);
Assignee:
CUBIC CORPORATION, San Diego, CA (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/373 (2006.01); H01P 3/06 (2006.01); H01P 11/00 (2006.01); H05K 1/02 (2006.01); H01L 23/58 (2006.01); H01L 23/528 (2006.01); H01L 23/552 (2006.01); H01L 23/00 (2006.01); H01L 23/66 (2006.01); H05K 3/40 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H01L 23/373 (2013.01); H01L 23/5286 (2013.01); H01L 23/552 (2013.01); H01L 23/562 (2013.01); H01L 23/58 (2013.01); H01L 23/66 (2013.01); H01P 3/06 (2013.01); H01P 11/005 (2013.01); H05K 1/0221 (2013.01); H05K 1/0224 (2013.01); H01L 2223/6627 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/85444 (2013.01); H01L 2924/01012 (2013.01); H01L 2924/01019 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/07811 (2013.01); H01L 2924/1423 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/3025 (2013.01); H01L 2924/30107 (2013.01); H05K 1/0272 (2013.01); H05K 3/4092 (2013.01); H05K 3/4661 (2013.01); H05K 2201/09809 (2013.01); H05K 2201/10636 (2013.01); H05K 2201/10674 (2013.01); H05K 2203/0733 (2013.01); H05K 2203/308 (2013.01); Y02P 70/611 (2015.11); Y10T 29/49002 (2015.01); Y10T 29/49018 (2015.01);
Abstract
Provided are integrated electronic components which include a waveguide microstructure formed by a sequential build process and an electronic device, and methods of forming such integrated electronic components. The microstructures have particular applicability to devices for transmitting electromagnetic energy and other electronic signals.