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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10431520 B1

PDFFull Text
Date of Patent:
Oct. 01, 2019

Filed:

Feb. 01, 2018

Semiconductor device and manufacturing method of semiconductor device

Applicant:

Fuji Electric Co., Ltd., Kanagawa, JP;

Inventor:

Susumu Iwamoto, Matsumoto, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kanagawa, JP;

Attorney:
Primary Examiner:

Mark V Prenty

Int. Cl.
CPC ...
H01L 23/42 (2006.01); H01L 23/367 (2006.01); H01L 23/043 (2006.01); H01L 21/52 (2006.01); H01L 23/373 (2006.01); H01L 23/40 (2006.01); H01L 23/538 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3675 (2013.01); H01L 21/52 (2013.01); H01L 21/565 (2013.01); H01L 23/043 (2013.01); H01L 23/3121 (2013.01); H01L 23/3735 (2013.01); H01L 23/4006 (2013.01); H01L 23/42 (2013.01); H01L 23/5385 (2013.01); H01L 25/0655 (2013.01);
Abstract

A space having a certain thickness is provided between a metal base and a heat-dissipation fin set or the like. A semiconductor device is provided, including: a package portion; a metal base which is housed in the package portion and is exposed at a lower surface of the package portion; a semiconductor chip which is housed in the package portion and is placed above the metal base; and a frame portion provided to surround a penetration space penetrating the package portion, wherein a lower end of the frame portion protrudes below the lower surface of the package portion and a lower surface of the metal base. It is preferable that the frame portion is inserted in the penetration space after the penetration space is formed in the package portion.

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