The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 01, 2019

Filed:

Dec. 01, 2014
Applicant:

National Institute of Advanced Industrial Science and Technology, Tokyo, JP;

Inventors:

Shiro Hara, Tsukuba, JP;

Sommawan Khumpuang, Tsukuba, JP;

Shinichi Ikeda, Tsukuba, JP;

Akihiro Goto, Yaizu, JP;

Hiroshi Amano, Yaizu, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01); B08B 3/08 (2006.01); B08B 3/10 (2006.01); B08B 3/12 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02057 (2013.01); B08B 3/08 (2013.01); B08B 3/10 (2013.01); B08B 3/12 (2013.01); H01L 21/6708 (2013.01); H01L 21/67051 (2013.01); H01L 21/67115 (2013.01); H01L 21/68764 (2013.01); H01L 21/02052 (2013.01);
Abstract

A wafer cleaner and a method therefor that efficiently cleans a wafer with a little amount of a cleaning liquid and efficiently performs a heating wet cleaning processing. The present invention includes a stage where a wafer is placed, a rotary driving unit that rotates the stage in a circumferential direction, a liquid discharge nozzle disposed facing the wafer placed on the stage and supplies a cleaning liquid on the wafer placed on the stage, and a control unit that causes the liquid discharge nozzle to supply a space between the wafer placed on the stage and the liquid discharge nozzle with a predetermined amount of the cleaning liquid to fill the space. The present invention also includes a lamp disposed on a position facing the wafer placed on the stage to heat at least an interface portion of the wafer and a cleaning liquid.


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