The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 01, 2019

Filed:

Jan. 23, 2017
Applicant:

Taiyo Yuden Co., Ltd., Tokyo, JP;

Inventors:

Takuya Moriya, Tokyo, JP;

Tsuyoshi Ogino, Tokyo, JP;

Koji Otsuka, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 5/00 (2006.01); H01G 4/40 (2006.01); H01F 41/04 (2006.01); H01G 4/005 (2006.01); H01F 17/00 (2006.01); H01F 27/29 (2006.01); H01G 4/012 (2006.01);
U.S. Cl.
CPC ...
H01G 4/40 (2013.01); H01F 5/00 (2013.01); H01F 5/003 (2013.01); H01F 17/0013 (2013.01); H01F 27/292 (2013.01); H01F 41/041 (2013.01); H01G 4/005 (2013.01); H01F 2017/0026 (2013.01); H01G 4/012 (2013.01);
Abstract

An electronic component according one embodiment of the disclosure includes an insulator, an internal conductor, and an external electrode. The insulator is made of a material containing resin. The insulator includes a first insulating layer that has a first bonding surface perpendicular to one axial direction and a second insulating layer bonded to the first bonding surface. The internal conductor includes a plurality of first via conductive members provided in the first insulating layer and a plurality of second via conductive members provided in the second insulating layer. Each of the first via conductive members has a first contact connected to the corresponding second via conductive member at a position offset in the one axial direction with respect to the first bonding surface.


Find Patent Forward Citations

Loading…