The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 01, 2019

Filed:

Aug. 31, 2015
Applicant:

Apple Inc., Cupertino, CA (US);

Inventors:

Gemin Li, Pleasanton, CA (US);

Paul Martinez, Morgan Hill, CA (US);

Benjamin A. Bard, Los Gatos, CA (US);

Connor R. Duke, Sunnyvale, CA (US);

Zhong-Qing Gong, Fremont, CA (US);

Kevin R. Richardson, Sunnyvale, CA (US);

Curtis C. Mead, Sacramento, CA (US);

Kieran Poulain, San Francisco, CA (US);

Sung Woo Yoo, Santa Clara, CA (US);

Nelson J. Kottke, Cupertino, CA (US);

Assignee:

Apple Inc., Cupertino, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); H01G 4/30 (2006.01); H01G 4/224 (2006.01); H05K 3/28 (2006.01); H01G 2/06 (2006.01); H05K 1/18 (2006.01); H05K 1/14 (2006.01);
U.S. Cl.
CPC ...
H01G 4/30 (2013.01); H01G 2/06 (2013.01); H01G 4/224 (2013.01); H05K 3/284 (2013.01); H05K 1/141 (2013.01); H05K 1/181 (2013.01); H05K 2201/049 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/2045 (2013.01); H05K 2203/1316 (2013.01); H05K 2203/1322 (2013.01);
Abstract

A printed circuit board (PCB) assembly having several electronic components mounted on a PCB and a damping layer covering the electronic components, is disclosed. Embodiments of the PCB assembly include an overmold layer constraining the damping layer against the PCB. Embodiments of the PCB assembly include an interposer between a capacitor of the electronic components and the PCB. Other embodiments are also described and claimed.


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