The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 01, 2019
Filed:
Aug. 31, 2016
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Inventors:
Woon Chul Choi, Suwon-si, KR;
Ji Hye Oh, Suwon-si, KR;
Jung Hyuk Jung, Suwon-si, KR;
Han Wool Ryu, Suwon-si, KR;
Assignee:
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 5/00 (2006.01); H01F 27/28 (2006.01); H01F 27/02 (2006.01); H01F 27/245 (2006.01); H01F 27/255 (2006.01); H01F 41/02 (2006.01); H01F 41/12 (2006.01); H01F 41/16 (2006.01); H01F 41/34 (2006.01);
U.S. Cl.
CPC ...
H01F 27/022 (2013.01); H01F 27/245 (2013.01); H01F 27/255 (2013.01); H01F 27/2804 (2013.01); H01F 41/0233 (2013.01); H01F 41/12 (2013.01); H01F 41/16 (2013.01); H01F 41/34 (2013.01);
Abstract
A coil electronic component includes a magnetic body, wherein the magnetic body includes a substrate, and a coil part including patterned insulating films disposed on the substrate, a first plating layer formed between the patterned insulating films by plating, and a second plating layer disposed on the first plating layer.