The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 01, 2019

Filed:

Mar. 23, 2016
Applicant:

Stanley Electric Co., Ltd., Meguro-ku, Tokyo, JP;

Inventor:

Akihiko Hanya, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01P 11/00 (2006.01); C09D 11/00 (2014.01); C09D 11/30 (2014.01); H01B 1/02 (2006.01); H01C 17/065 (2006.01); H01C 17/24 (2006.01); H01B 1/22 (2006.01); H01C 7/00 (2006.01); H01C 17/22 (2006.01); H05K 1/16 (2006.01); H05K 1/09 (2006.01); H05K 3/12 (2006.01);
U.S. Cl.
CPC ...
H01C 17/065 (2013.01); H01B 1/22 (2013.01); H01C 7/003 (2013.01); H01C 17/22 (2013.01); H01C 17/24 (2013.01); H05K 1/097 (2013.01); H05K 1/167 (2013.01); H05K 3/1283 (2013.01); H05K 2203/1131 (2013.01);
Abstract

A resistor manufacturing method includes a first step of applying a solution wherein conductive nanosized particles with a particle diameter of less than 1 μm and an insulating material are at least dispersed, or a solution wherein the conductive nanosized particles covered with an insulating material layer are at least dispersed, in a desired form on a substrate surface, thereby forming a film. The resistor manufacturing method also includes a second step of irradiating one portion of the film with light in a predetermined pattern, and sintering the conductive nanosized particles with the light, thereby forming a resistive film that is a conductive particle layer of the predetermined pattern.


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