The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 01, 2019

Filed:

Oct. 27, 2014
Applicant:

Fujikura Ltd., Tokyo, JP;

Inventors:

Yuji Saito, Tokyo, JP;

Mohammad Shahed Ahamed, Tokyo, JP;

Makoto Takahashi, Tokyo, JP;

Akihiro Takamiya, Tokyo, JP;

Assignee:

FUJIKURA LTD., Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 1/20 (2006.01); H05K 7/20 (2006.01); H04M 1/02 (2006.01); F28D 15/02 (2006.01); F28F 3/08 (2006.01); F28D 15/04 (2006.01); H01L 23/427 (2006.01);
U.S. Cl.
CPC ...
G06F 1/203 (2013.01); F28D 15/0266 (2013.01); F28D 15/043 (2013.01); F28D 15/046 (2013.01); F28F 3/086 (2013.01); H01L 23/427 (2013.01); H05K 7/20336 (2013.01); H04M 1/0202 (2013.01);
Abstract

A cooling structure for a portable electronic device is provided, configured to accommodate, within a case having a sealing structure, a substrate on which a heat-generating component that generates heat during operation is mounted, and provided with a heat sink that diffuses the heat from the heat-generating component to a place away from the heat-generating component. The heat sink is integrated into an inner surface of an area corresponding to a front cover of the case or an inner surface of an area corresponding to a rear cover of the case, and a flat heat pipe flattened by being compressed in a thickness direction of the case is disposed such that one end is attached by being sandwiched between the heat-generating component and the heat sink while another end is arranged in close contact with the heat sink.


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