The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 01, 2019

Filed:

Apr. 12, 2018
Applicant:

Raycap S.a., Athens, GR;

Inventors:

Konstantinos Bakatsias, Athens, GR;

Elias Gonalakis, Athens, GR;

Charis Coletti, Athens, GR;

Eleni Dimou, Athens, GR;

Assignee:

RAYCAP S.A., Athens, GR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/36 (2006.01); G02B 6/44 (2006.01); H04B 10/079 (2013.01); H04W 88/08 (2009.01); H04B 10/80 (2013.01); H04B 10/077 (2013.01);
U.S. Cl.
CPC ...
G02B 6/4472 (2013.01); G02B 6/4452 (2013.01); G02B 6/4455 (2013.01); H04B 10/077 (2013.01); H04B 10/07953 (2013.01); H04B 10/801 (2013.01); H04W 88/085 (2013.01);
Abstract

An optical interface includes a rack mountable enclosure that includes multiple slots for retaining multiple insertable fiber optic (FO) modules. The FO modules include a first set of interconnection ports that connect to remote radio units (RRUs), a second set of interconnection ports that connect to a baseband unit (BBU), and a third set of monitoring ports that connect to monitoring/text equipment. The FO modules contain fiber splitters that split off uplink/receive and downlink/transmit signals carried on optical fibers to the third set of monitoring ports. The FO modules may insert in different orientations and directions into different rack mountable enclosure configurations for higher density and more configurable connectivity. A splitter holder is located within the FO module and provides improved optical fiber routing for more integrated module port interconnectivity.


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