The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 01, 2019

Filed:

Aug. 30, 2018
Applicants:

Beijing Boe Optoelectronics Technology Co., Ltd., Beijing, CN;

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Desheng Xiang, Beijing, CN;

Yanming Wang, Beijing, CN;

Jiaqiang Wang, Beijing, CN;

Dawei Wang, Beijing, CN;

Rui Liu, Beijing, CN;

Sa Li, Beijing, CN;

Xi Chen, Beijing, CN;

Yajun Guo, Beijing, CN;

Yafeng Wang, Beijing, CN;

Jianwu Wu, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F21V 7/04 (2006.01); F21V 8/00 (2006.01);
U.S. Cl.
CPC ...
G02B 6/005 (2013.01); G02B 6/0051 (2013.01); G02B 6/0053 (2013.01); G02B 6/0083 (2013.01);
Abstract

The present disclosure relates to a backlight module. The backlight module includes a back plate, a circuit layer, a light source and a plurality of connecting leads. The back plate has a first surface and a second surface which are opposite to each other, wherein the back plate is provided with a plurality of through holes penetrating the first surface and the second surface. The circuit layer is disposed on the first surface to form a driving circuit for a light source. The light source is disposed on a surface of the circuit layer away from the back plate and formed integrally with the back plate. The plurality of connecting leads pass through the plurality of through holes one-to-one for connecting the circuit layer and a main circuit board.


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