The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 01, 2019
Filed:
Dec. 01, 2017
Jessica G. Swallow, Cambridge, MA (US);
Krystyn J. Van Vliet, Lexington, MA (US);
Harry L. Tuller, Wellesley, MA (US);
Sean R. Bishop, Silver Spring, MD (US);
Jae Jin Kim, Naperville, IL (US);
James F. Smith, Denbighshire, GB;
Jessica G. Swallow, Cambridge, MA (US);
Krystyn J. Van Vliet, Lexington, MA (US);
Harry L. Tuller, Wellesley, MA (US);
Sean R. Bishop, Silver Spring, MD (US);
Jae Jin Kim, Naperville, IL (US);
James F. Smith, Denbighshire, GB;
Massachusetts Institute of Technology, Cambridge, MA (US);
Abstract
Current techniques for measuring chemical expansion in thin film structures are too slow, too imprecise, or require synchrotrons. In contrast, nanoscale electrochemomechanical spectroscopy (NECS) can be used to make nanoscale measurements at time scales of seconds with simple contact or non-contact sensors. In a NECS measurement, a sample, such as thin-film oxide structure, is subjected to a temporally modulated stimulus, such as a sinusoidally alternating voltage. The stimulus causes the sample to expand, contract, deflect, or otherwise deform. A sensor, such as a contact probe or optical sensor, produces an electrical signal in response to this deformation that is correlated with the temporal modulation of the stimulus. Because the stimulus and deformation are correlated, the temporal modulation of the stimulus can be used to filter the deformation signal produced by the sensor, producing a precise, sensitive measurement of the deformation.