The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 01, 2019

Filed:

Nov. 25, 2013
Applicant:

Reifenhaeuser Gmbh & Co. KG Maschinenfabrik, Troisdorf, DE;

Inventors:

Claudio Cinquemani, Cologne, DE;

Detlef Frey, Niederkassel, DE;

Hans-Georg Geus, Niederkassel, DE;

Peter Schlag, Troisdorf, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
D01D 5/088 (2006.01); D01F 6/06 (2006.01); D01D 7/00 (2006.01); D04H 3/005 (2012.01); D04H 3/007 (2012.01); D04H 3/16 (2006.01); D01D 5/098 (2006.01); B29C 48/05 (2019.01); B29D 99/00 (2010.01); B29L 31/00 (2006.01);
U.S. Cl.
CPC ...
D01D 5/088 (2013.01); D01D 5/0985 (2013.01); D01D 7/00 (2013.01); D01F 6/06 (2013.01); D04H 3/005 (2013.01); D04H 3/007 (2013.01); D04H 3/16 (2013.01); B29C 48/05 (2019.02); B29D 99/0078 (2013.01); B29L 2031/731 (2013.01);
Abstract

The invention relates to a device for producing a spun-bonded web from filaments, comprising spinnerets, a cooling chamber into which process air can be introduced in order to cool the filaments, a monomer suction device arranged between the spinnerets and the cooling chamber, a stretching unit, and a placing device for placing the filaments so as to form the spun-bonded web. The cooling chamber is divided into two cooling chamber portions. Process air can be suctioned out of a first upper cooling chamber portion to the monomer suction device with a volumetric flow rate V, and process air exits the first upper cooling chamber portion into a second lower cooling chamber portion with a volumetric flow rate V. The volumetric flow rate ratio V/Vis 0.1 to 0.3.


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