logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10427394 B1

PDFFull Text
Date of Patent:
Oct. 01, 2019

Filed:

Nov. 06, 2014

Method for curing resin composition

Applicant:

Omron Corporation, Kyoto-shi, Kyoto, JP;

Inventors:

Seiji Nakajima, Moriyama, JP;

Yosuke Tatsuno, Kusatsu, JP;

Mitsuo Ito, Kikuchi-gun, JP;

Satoshi Hirono, Kusatsu, JP;

Yuzo Morisaki, Kusatsu, JP;

Junji Kawamoto, Kyoto, JP;

Assignee:

OMRON Corporation, Kyoto-shi, JP;

Attorney:

Metroplex IP Law Group, PLLC

Primary Examiner:

Christopher T Schatz

Int. Cl.
CPC ...
B32B 37/12 (2006.01); B32B 15/092 (2006.01); B32B 27/16 (2006.01); B32B 27/20 (2006.01); B32B 27/26 (2006.01); B32B 27/38 (2006.01); B32B 7/12 (2006.01); B32B 15/09 (2006.01); C08K 3/04 (2006.01); C08K 3/36 (2006.01); C08K 3/40 (2006.01); C08K 5/00 (2006.01); C09J 5/00 (2006.01); C09J 11/00 (2006.01); C09J 163/00 (2006.01); C08L 63/00 (2006.01); C08G 59/18 (2006.01); C08G 59/24 (2006.01); C08G 59/50 (2006.01); C08G 59/68 (2006.01); B32B 27/08 (2006.01); B32B 27/36 (2006.01); B32B 38/00 (2006.01); C08K 3/22 (2006.01); C08J 3/24 (2006.01); C08K 7/20 (2006.01); B29C 35/08 (2006.01);
U.S. Cl.
CPC ...
B32B 37/1207 (2013.01); B32B 7/12 (2013.01); B32B 15/09 (2013.01); B32B 15/092 (2013.01); B32B 27/08 (2013.01); B32B 27/16 (2013.01); B32B 27/20 (2013.01); B32B 27/26 (2013.01); B32B 27/365 (2013.01); B32B 27/38 (2013.01); B32B 38/0008 (2013.01); C08G 59/188 (2013.01); C08G 59/245 (2013.01); C08G 59/5033 (2013.01); C08G 59/686 (2013.01); C08J 3/241 (2013.01); C08K 3/04 (2013.01); C08K 3/22 (2013.01); C08K 3/36 (2013.01); C08K 3/40 (2013.01); C08K 5/00 (2013.01); C08K 7/20 (2013.01); C08L 63/00 (2013.01); C09J 5/00 (2013.01); C09J 11/00 (2013.01); C09J 163/00 (2013.01); B29C 2035/0838 (2013.01); B32B 2037/1253 (2013.01); B32B 2250/02 (2013.01); B32B 2250/244 (2013.01); B32B 2255/10 (2013.01); B32B 2255/26 (2013.01); B32B 2264/101 (2013.01); B32B 2264/102 (2013.01); B32B 2307/302 (2013.01); B32B 2307/402 (2013.01); B32B 2310/0843 (2013.01); B32B 2311/00 (2013.01); B32B 2363/00 (2013.01); B32B 2367/00 (2013.01); B32B 2369/00 (2013.01); B32B 2457/00 (2013.01); B32B 2581/00 (2013.01); C08J 2363/00 (2013.01); C08K 2003/2265 (2013.01);
Abstract

The present invention provides a method with which curing can be carried out in a short time without a heat load on an adherend and a cured product having stable quality can be obtained. The resin composition curing method in accordance with the present invention includes the step (a) of directly and/or indirectly irradiating, with laser light, a resin composition (A) which contains (i) an epoxy resin, (ii) an encapsulated curing agent including a core that contains a curing agent and a shell that covers the core, (iii) a filler, and (iv) a color material.

Find Patent Forward Citations

Loading…