The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 01, 2019

Filed:

Mar. 07, 2017
Applicants:

Chang-uk Lee, Seattle, WA (US);

Adam Edward Goetz, Niantic, CT (US);

Yosuke Ashikari, Seattle, WA (US);

Andrew Jackson Boydston, Seattle, WA (US);

Mark A. Ganter, Edmonds, WA (US);

Duane William Storti, Seattle, WA (US);

Inventors:

Chang-Uk Lee, Seattle, WA (US);

Adam Edward Goetz, Niantic, CT (US);

Yosuke Ashikari, Seattle, WA (US);

Andrew Jackson Boydston, Seattle, WA (US);

Mark A. Ganter, Edmonds, WA (US);

Duane William Storti, Seattle, WA (US);

Assignees:

Ricoh Company, Ltd., Tokyo, JP;

University of Washington, Seattle, WA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 64/165 (2017.01); B33Y 80/00 (2015.01); B33Y 10/00 (2015.01); B33Y 70/00 (2015.01); B29K 71/00 (2006.01); B29K 105/00 (2006.01);
U.S. Cl.
CPC ...
B29C 64/165 (2017.08); B33Y 10/00 (2014.12); B33Y 70/00 (2014.12); B33Y 80/00 (2014.12); B29K 2071/00 (2013.01); B29K 2105/0014 (2013.01);
Abstract

The present invention provides high performance polymer (HPP) compositions, methods, processes, and systems for the manufacture of three-dimensional articles made of polymers using molding or 3D printing. The HPP compositions comprise a first HPP dissolved in a solvent and a second HPP present as a solid having particular particle size.


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