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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10427327 B1

PDFFull Text
Date of Patent:
Oct. 01, 2019

Filed:

Jun. 22, 2015

Separation device and separation method

Applicant:

Daiki Co., Ltd., Tokyo, JP;

Inventors:

Hiroshi Ito, Tokyo, JP;

Shinobu Hatanaka, Tochigi, JP;

Junji Yoshinaga, Tokyo, JP;

Hiroyuki Ando, Kagawa, JP;

Assignee:

DAIKI CO., LTD., Tokyo, JP;

Attorney:

Oliff PLC

Primary Examiner:

Shelley M Self

Assistant Examiner:

Smith Oberto Bapthelus

Int. Cl.
CPC ...
B29B 17/02 (2006.01); B02C 21/00 (2006.01); B02C 23/10 (2006.01); B02C 23/14 (2006.01); B02C 23/16 (2006.01); B07B 1/24 (2006.01); B09B 3/00 (2006.01); B09B 5/00 (2006.01); B29B 17/04 (2006.01); B03B 9/06 (2006.01); B29L 31/48 (2006.01);
U.S. Cl.
CPC ...
B29B 17/02 (2013.01); B02C 21/00 (2013.01); B02C 23/10 (2013.01); B02C 23/14 (2013.01); B02C 23/16 (2013.01); B03B 9/061 (2013.01); B07B 1/24 (2013.01); B09B 3/00 (2013.01); B09B 5/00 (2013.01); B29B 17/0412 (2013.01); B02C 2023/165 (2013.01); B29B 17/04 (2013.01); B29B 2017/0224 (2013.01); B29B 2017/0468 (2013.01); B29B 2017/0476 (2013.01); B29B 2017/0484 (2013.01); B29L 2031/4878 (2013.01); Y02W 30/521 (2015.05); Y02W 30/523 (2015.05); Y02W 30/622 (2015.05); Y02W 30/625 (2015.05);
Abstract

A separation device includes a first shredding unit, a first separation unit, a second shredding unit, and a second separation unit. The first shredding unit shreds a processing target containing a first material and a second material. The first separation unit rotates a first tubular portion in a state in which the processing target shredded by the first shredding unit is accommodated therein, thereby separating the second material passing through first holes from the processing target. The second shredding unit shreds the processing target from which the second material passing through the first holes is separated by the first separation unit. The second separation unit rotates a second tubular portion in a state in which the processing target shredded by the second shredding unit is accommodated therein, thereby separating the second material passing through second holes from the processing target.

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