The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 01, 2019

Filed:

Sep. 19, 2016
Applicant:

Olympus Corporation, Tokyo, JP;

Inventors:

Mikio Nakamura, Tokyo, JP;

Takanori Sekido, Machida, JP;

Nau Satake, Yokohama, JP;

Assignee:

Olympus Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61B 1/05 (2006.01); H01L 23/31 (2006.01); H01L 27/146 (2006.01); A61B 1/04 (2006.01); H01L 21/56 (2006.01); B23K 1/00 (2006.01); B23K 3/06 (2006.01); H01L 25/10 (2006.01); A61B 1/00 (2006.01); H01L 31/02 (2006.01); H01L 31/0203 (2014.01); H04N 5/225 (2006.01); B23K 101/42 (2006.01);
U.S. Cl.
CPC ...
A61B 1/04 (2013.01); A61B 1/0011 (2013.01); A61B 1/051 (2013.01); B23K 1/0016 (2013.01); B23K 3/0623 (2013.01); H01L 21/56 (2013.01); H01L 25/10 (2013.01); H01L 31/02002 (2013.01); H01L 31/0203 (2013.01); B23K 2101/42 (2018.08); H01L 23/3121 (2013.01); H01L 2224/73204 (2013.01); H04N 5/2253 (2013.01); H04N 2005/2255 (2013.01);
Abstract

An imaging apparatus mount assembly for an image sensor chip includes a substrate, a plurality of first pins and at least one first electronic component, both mounted on a first surface of the substrate, and a first resin sealant configured to seal the first surface so as to expose an end face of a first shaft section opposite to where a first connecting section is provided. A plurality of second pins and at least one second electronic component are both mounted on a second surf ace of the substrate. A second resin sealant is configured to seal the second surface so as to expose an end face of a second shaft section opposite to where a second connecting section is provided. The image sensor chip includes a light receiving unit and a back-surface electrode, the first shaft section exposed on the first resin sealant is connected to the back-surface electrode.


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