The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 24, 2019

Filed:

Jul. 12, 2013
Applicant:

Fuji Corporation, Chiryu, JP;

Inventor:

Mitsuru Sanji, Chiryu, JP;

Assignee:

FUJI CORPORATION, Chiryu, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 13/04 (2006.01); H05K 3/30 (2006.01);
U.S. Cl.
CPC ...
H05K 13/0404 (2013.01); H05K 3/30 (2013.01); H05K 13/0408 (2013.01); H05K 13/0413 (2013.01);
Abstract

The method for assembling a component on a board is configured by a transfer pressing step that assembles a target gripping location of a component by gripping the target gripping location using a component transfer device, performing positioning, and applying a pressing force to a board side, and a pressing step that simultaneously assembles each corresponding portion of the component by positioning at least two holding claws of a component gripping device in predetermined positions, and applying a pressing force to the component on the board side using each holding claw.


Find Patent Forward Citations

Sanji, Mitsuru. (2019). Method of mounting component on to substrate in component mounting device and component mounting device (U.S. Patent No. 10426070). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10426070

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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