The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 24, 2019

Filed:

Aug. 30, 2017
Applicant:

Elite Electronic Material (Zhongshan) Co., Ltd., Zhongshan, Guang Dong Prov., CN;

Inventors:

Xiang Xiong, Zhongshan, CN;

Zhilong Hu, Zhongshan, CN;

Assignee:

ELITE ELECTRONIC MATERIAL (ZHONGSHAN) CO., LTD., Zhongshan, Guang Dong Province, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); C08L 63/00 (2006.01); B32B 15/20 (2006.01); H05K 3/38 (2006.01); C08J 5/24 (2006.01); B32B 15/092 (2006.01); H05K 1/03 (2006.01); C08G 73/02 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H05K 3/389 (2013.01); B32B 15/092 (2013.01); B32B 15/20 (2013.01); C08G 73/0233 (2013.01); C08J 5/24 (2013.01); C08L 63/00 (2013.01); H05K 1/0373 (2013.01); B32B 2307/206 (2013.01); B32B 2457/08 (2013.01); C08J 2363/00 (2013.01); C08J 2463/00 (2013.01); C08J 2479/04 (2013.01); C08L 2205/02 (2013.01); C08L 2205/03 (2013.01); H05K 1/09 (2013.01); H05K 3/007 (2013.01); H05K 2201/012 (2013.01); H05K 2201/0355 (2013.01);
Abstract

Disclosed is an assembly comprising an insulation material and a copper foil disposed on the insulation material, wherein the copper foil has a thickness of less than or equal to 6 μm, and the insulation material is made from a resin composition comprising oxazolidone epoxy resin, oxydianiline type benzoxazine resin and a curing agent. The assembly achieves desirable balanced properties in peel strength, glass transition temperature, dimensional change after reflow, thermal resistance, and dielectric properties.


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