The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 24, 2019
Filed:
Oct. 22, 2015
Applicant:
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Inventors:
Jung-Je Bang, Gyeonggi-do, KR;
Mi-Jin Kim, Gyeonggi-do, KR;
Sae-Bom Lee, Gyeonggi-do, KR;
Hyun-Joo Han, Gyeonggi-do, KR;
Kun-Tak Kim, Gyeonggi-do, KR;
Assignee:
Samsung Electronics Co., Ltd, , KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/32 (2006.01); H01L 23/552 (2006.01); H01L 23/00 (2006.01); H05K 1/02 (2006.01); H05K 3/34 (2006.01); H01L 23/36 (2006.01); H01L 23/10 (2006.01); H01L 21/56 (2006.01); H01L 23/373 (2006.01); H01L 23/42 (2006.01); H01L 23/427 (2006.01);
U.S. Cl.
CPC ...
H05K 3/321 (2013.01); H01L 23/36 (2013.01); H01L 23/552 (2013.01); H01L 24/29 (2013.01); H01L 24/92 (2013.01); H05K 1/0203 (2013.01); H05K 3/341 (2013.01); H01L 21/563 (2013.01); H01L 23/10 (2013.01); H01L 23/3737 (2013.01); H01L 23/42 (2013.01); H01L 23/4275 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/29194 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/73203 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/81191 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/83855 (2013.01); H01L 2224/9221 (2013.01); H01L 2224/92125 (2013.01); H01L 2224/92225 (2013.01); H01L 2924/1421 (2013.01); H01L 2924/16152 (2013.01); H01L 2924/16235 (2013.01); H01L 2924/16251 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/3025 (2013.01); H05K 1/023 (2013.01); H05K 1/0216 (2013.01); H05K 3/3494 (2013.01); H05K 2201/066 (2013.01); H05K 2201/1056 (2013.01); H05K 2201/10371 (2013.01); Y02P 70/613 (2015.11);
Abstract
A method is provided for manufacturing a printed circuit board assembly. A method includes applying a liquefied radiant-heat material on a heating component mounted on the printed circuit board; mounting a shield unit on the printed circuit board in contact with the liquefied radiant-heat material; and simultaneously curing the liquefied radiant-heat material and bonding the shield unit.