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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10426039 B1

PDFFull Text
Date of Patent:
Sep. 24, 2019

Filed:

Mar. 21, 2016

Method for stencil printing during manufacture of printed circuit board

Applicants:

Fu Tai Hua Industry (Shenzhen) Co., Ltd., Shenzhen, CN;

Hon Hai Precision Industry Co., Ltd., New Taipei, TW;

Inventor:

Xue-Qin Zhang, Shenzhen, CN;

Assignees:

Fu Tai Hua Industry (Shenzhen) Co., Ltd., Shenzhen, CN;

HON HAI PRECISION INDUSTRY CO., LTD., New Taipei, TW;

Attorney:

ScienBiziP, P.C.

Primary Examiner:

Peter Dungba Vo

Assistant Examiner:

Kaying Kue

Int. Cl.
CPC ...
H05K 3/40 (2006.01); H05K 3/12 (2006.01); H05K 3/00 (2006.01); H05K 3/24 (2006.01); H05K 3/42 (2006.01); H05K 13/08 (2006.01);
U.S. Cl.
CPC ...
H05K 3/1225 (2013.01); H05K 3/0044 (2013.01); H05K 3/245 (2013.01); H05K 3/429 (2013.01); H05K 13/08 (2013.01); Y10T 29/49124 (2015.01); Y10T 29/49155 (2015.01);
Abstract

A method for stencil printing during manufacture of a printed circuit board includes forming a circuit diagram on a trepanned circuit board using a first stencil that has the circuit diagram, a scraper and conductive inks, forming a solder mask layer on the circuit board using a second stencil, the scraper, and solder materials, forming words and marks on the circuit board using a third stencil, the scraper, and inks, and forming a solder paste layer on the circuit board using a fourth stencil, the scraper, and solder paste.

Find Patent Forward Citations

Zhang, Xue-Qin. (2019). Method for stencil printing during manufacture of printed circuit board (U.S. Patent No. 10426039). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10426039

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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