The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 24, 2019
Filed:
Apr. 03, 2019
Applicant:
Tdk Corporation, Tokyo, JP;
Inventors:
Hajime Kuwajima, Tokyo, JP;
Tomonaga Nishikawa, Tokyo, JP;
Takashi Ohtsuka, Tokyo, JP;
Takeshi Oohashi, Tokyo, JP;
Yuichiro Okuyama, Tokyo, JP;
Manabu Yamatani, Tokyo, JP;
Assignee:
TDK CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); H05K 1/02 (2006.01); H05K 3/02 (2006.01); H05K 1/11 (2006.01); H05K 3/06 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/115 (2013.01); H05K 1/09 (2013.01); H05K 1/111 (2013.01); H05K 3/06 (2013.01); H05K 3/4644 (2013.01);
Abstract
Disclosed herein is a multilayer wiring structure that includes a first metal layer; an interlayer insulating film formed on the first metal layer, the interlayer insulating film having an opening that exposes a first area of the first metal layer; a second metal layer formed on an inner wall of the opening; and a third metal layer filling the opening via the second metal layer. The first and third metal layers are direct contact with each other at a bottom of the opening.