The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 24, 2019

Filed:

Oct. 17, 2017
Applicant:

City University of Hong Kong, Kowloon, HK;

Inventors:

Moshe Zukerman, Kowloon, HK;

Zengfu Wang, Shaanxi, CN;

Qing Wang, Kowloon, HK;

Yu Wang, Kowloon, HK;

Gang Wang, Kowloon, HK;

William Moran, Balwyn, AU;

Felipe Cucker, Kowloon, HK;

Jun Guo, Guangdong, CN;

Elias Tahchi, Quarry Bay, HK;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04L 12/24 (2006.01); G06Q 50/08 (2012.01); H04L 12/721 (2013.01); G06Q 10/06 (2012.01);
U.S. Cl.
CPC ...
H04L 41/0836 (2013.01); G06Q 10/06313 (2013.01); G06Q 50/08 (2013.01); H04L 41/0826 (2013.01); H04L 41/145 (2013.01); H04L 45/124 (2013.01);
Abstract

A method for determining an optimal laying arrangement of a new infrastructure link for connection from a new site to an existing infrastructure network includes modeling a terrain of a region around and at the new site and the existing infrastructure network near the new site; modeling each factor affecting the laying arrangement as a respective cost function; applying a respective weighting to each of the cost function to determine a life-cycle cost function; and determining, based on the determined life-cycle cost function, an optimized laying arrangement with minimal life-cycle cost from the new site to a connection point in the existing infrastructure network.


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