The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 24, 2019
Filed:
Feb. 27, 2017
Applicant:
Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;
Inventors:
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 5/024 (2006.01); H01S 5/022 (2006.01); H01S 5/026 (2006.01); H01S 5/042 (2006.01); H01S 5/40 (2006.01);
U.S. Cl.
CPC ...
H01S 5/02423 (2013.01); H01S 5/026 (2013.01); H01S 5/02236 (2013.01); H01S 5/02469 (2013.01); H01S 5/0425 (2013.01); H01S 5/02264 (2013.01); H01S 5/02272 (2013.01); H01S 5/02276 (2013.01); H01S 5/02492 (2013.01); H01S 5/4025 (2013.01);
Abstract
A semiconductor laser device includes a heat sink, a submount, a first electrode, an insulating layer, a semiconductor laser element, a connecting portion, and a second electrode. The submount is conductive and on a first region of an upper surface of the heat sink. The first electrode is conductive and on a second region, different from the first region, of the upper surface of the heat sink. The first electrode is electrically connected either to at least part of a side surface of the submount or to an upper surface of the submount.