The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 24, 2019
Filed:
Sep. 19, 2018
Applicant:
3m Innovative Properties Company, St. Paul, MN (US);
Inventors:
Ravi Palaniswamy, Singapore, SG;
Alejandro Aldrin II Agcaoili Narag, Singapore, SG;
Siang Sin Foo, Singapore, SG;
Hiromitsu Kosugi, Tokyo, JP;
Assignee:
3M INNOVATIVE PROPERTIES COMPANY, St. Paul, MN (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/62 (2010.01); B32B 15/08 (2006.01); H05K 1/03 (2006.01); B32B 7/12 (2006.01); B32B 27/28 (2006.01); H01L 33/48 (2010.01); H01L 33/58 (2010.01); H05K 1/18 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); B32B 7/12 (2013.01); B32B 15/08 (2013.01); B32B 27/281 (2013.01); H01L 33/486 (2013.01); H01L 33/58 (2013.01); H05K 1/036 (2013.01); B32B 2255/10 (2013.01); B32B 2255/20 (2013.01); B32B 2307/202 (2013.01); B32B 2457/202 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0058 (2013.01); H01L 2933/0066 (2013.01); H05K 1/0306 (2013.01); H05K 1/0346 (2013.01); H05K 1/189 (2013.01); H05K 3/28 (2013.01); H05K 2201/017 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/0179 (2013.01); H05K 2201/09827 (2013.01); H05K 2201/09881 (2013.01); H05K 2201/10106 (2013.01);
Abstract
Flexible LED assemblies are described. More particularly, flexible LED assemblies having substrates with conductive features positioned on or in the substrate, and layers of ceramic positioned over exposed portions of the substrate to protect against UV degradation, as well as methods of making such assembles, are described.