The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 24, 2019
Filed:
Sep. 28, 2017
Jianwei Chen, Shenzhen, CN;
Jianwei Chen, Shenzhen, CN;
Other;
Abstract
An LED flip chip die-bond conductive adhesive structure includes an LED flip chip and an electronic circuit board. An LED flip chip negative electrode, an LED flip chip nonmetallic region and an LED flip chip positive electrode are sequentially arranged on a lower surface of the LED flip chip from left to right; a circuit board negative electrode, a circuit board nonmetallic region and a circuit board positive electrode are sequentially arranged on an upper surface of the electronic circuit board from left to right. The LED flip chip and the electronic circuit board are fixedly connected through a thermosetting die-bond insulating adhesive bonded between the LED flip chip nonmetallic region and the circuit board nonmetallic region; and the LED flip chip positive and negative electrodes are respectively conductively connected with the circuit board positive and negative electrodes in a direct metal-metal contact manner.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile