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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10424704 B1

PDFFull Text
Date of Patent:
Sep. 24, 2019

Filed:

Jul. 18, 2016

Light-emitting device package

Applicant:

Lg Innotek Co., Ltd., Seoul, KR;

Inventors:

Dong Hyun Yu, Seoul, KR;

Bong Kul Min, Seoul, KR;

Assignee:

LG INNOTEK CO., LTD., Seoul, KR;

Attorney:

Birch, Stewart, Kolasch & Birch, LLP

Primary Examiner:

Brian Turner

Int. Cl.
CPC ...
H01L 33/36 (2010.01); H01L 33/52 (2010.01); H01L 33/64 (2010.01); H01L 33/62 (2010.01); H01L 33/54 (2010.01); H01L 33/60 (2010.01); H01L 25/16 (2006.01); H01L 33/48 (2010.01);
U.S. Cl.
CPC ...
H01L 33/60 (2013.01); H01L 25/167 (2013.01); H01L 33/486 (2013.01); H01L 33/52 (2013.01); H01L 33/62 (2013.01); H01L 33/36 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48257 (2013.01); H01L 2224/8592 (2013.01); H01L 2924/181 (2013.01);
Abstract

A light-emitting device package according to an embodiment includes first and second lead frames, a package body exposing a portion of a front surface of at least one of the first or second lead frame, a light-emitting device, a protecting device, and at least one wire configured to electrically connect the exposed front surface of at least one of the first or second lead frame to at least one of the light-emitting device or the protecting device, wherein the exposed front surface of at least one of the first or second lead frame includes at least one bonding area connected to the at least one wire, wherein the at least one bonding area has a planar shape in which the at least one bonding area is disposed so as to contact a corner of the exposed front surface of at least one of the first or second lead frame.

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