The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 24, 2019
Filed:
Aug. 17, 2017
Silanna Asia Pte Ltd, Singapore, SG;
Shanghui Larry Tu, San Diego, CA (US);
Michael A. Stuber, Rancho Santa Fe, CA (US);
Befruz Tasbas, San Diego, CA (US);
Stuart B. Molin, Carlsbad, CA (US);
Raymond Jiang, Raleigh, NC (US);
Silanna Asia Pte Ltd, Singapore, SG;
Abstract
A semiconductor package includes a leadframe having perimeter package leads and electrical connectors, a single semiconductor die having a back-side electrical contact and front-side electrical contacts, an electrically conductive clip ('clip'), and a top semiconductor die having a frontside and a backside. The single semiconductor die includes two or more transistors. Two or more of the front-side electrical contacts of the semiconductor die are electrically coupled to and physically mounted to respective electrical contacts of the leadframe. An electrical contact surface of the clip is electrically coupled to and physically mounted to an electrical connector of the leadframe. Another electrical contact surface of the clip is physically mounted to and electrically coupled to the back-side electrical contact of the semiconductor die. The backside of the top semiconductor die is physically mounted to yet another surface of the electrically conductive clip.