The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 24, 2019

Filed:

Aug. 02, 2018
Applicant:

Stmicroelectronics S.r.l., Agrate Brianza (MB), IT;

Inventors:

Alberto Pagani, Nova Milanese, IT;

Alessandro Finocchiaro, Catania, IT;

Assignee:

STMicroelectronics S.r.l., Agrate Brianza (MB), IT;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 49/02 (2006.01); G01R 31/28 (2006.01); G01R 31/302 (2006.01); H01L 21/66 (2006.01); H01L 23/528 (2006.01); H01L 23/00 (2006.01); H01L 23/58 (2006.01); H01L 23/66 (2006.01); H01L 29/06 (2006.01); H01L 23/544 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 28/10 (2013.01); G01R 31/2834 (2013.01); G01R 31/2889 (2013.01); G01R 31/3025 (2013.01); H01L 22/32 (2013.01); H01L 22/34 (2013.01); H01L 23/528 (2013.01); H01L 23/544 (2013.01); H01L 23/564 (2013.01); H01L 23/585 (2013.01); H01L 23/66 (2013.01); H01L 24/05 (2013.01); H01L 25/0657 (2013.01); H01L 29/0642 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/02166 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05553 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48465 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/181 (2013.01); H01L 2924/30107 (2013.01);
Abstract

A probe card for integrated circuit testing includes a printed circuit support and a probe head having a first surface mounted to a surface of the printed circuit support. A flexible substrate is positioned adjacent to a second surface of the probe head and includes at least one flexible extension which extends beyond an edge of the probe head and includes a bend to make contact with the surface of the printed circuit support. The flexible substrate further includes a test antenna configured to support a wireless communications channel with an integrated circuit under test. The integrated circuit under test includes at least one conductive structure that extends in the peripheral portion on different planes of metallizations to form an integrated antenna that is coupled for communication and/or power transfer to the test antenna.


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