The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 24, 2019
Filed:
Apr. 17, 2018
Delta Electronics Int'l (Singapore) Pte Ltd, Singapore, SG;
Beng Beng Lim, Singapore, SG;
DELTA ELECTRONICS INT'L (SINGAPORE) PTE LTD, Singapore, SG;
Abstract
A packaging process of an electronic component is provided. By the packaging process of the disclosure, the electronic component is grinded by the back grinding process. Consequently, thickness of the electronic component may be reduced to less than or equal to 50 μm. The packaging process may achieve ultra-thin thickness and reduce the space of the power module. Moreover, the packaging process forms the contact pads with drilling process and grinding process without photolithography process. Consequently, the packaging process is advantageous because of lower cost and uniform thickness of the contact pads.