The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 24, 2019
Filed:
Sep. 27, 2018
Applicant:
Nikon Corporation, Tokyo, JP;
Inventors:
Assignee:
NIKON CORPORATION, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/18 (2006.01); H01L 23/544 (2006.01); H01L 21/66 (2006.01); H01L 21/02 (2006.01); H01L 21/20 (2006.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01); H01L 21/68 (2006.01);
U.S. Cl.
CPC ...
H01L 24/80 (2013.01); H01L 21/02 (2013.01); H01L 21/187 (2013.01); H01L 21/2007 (2013.01); H01L 21/67092 (2013.01); H01L 21/67103 (2013.01); H01L 21/67248 (2013.01); H01L 21/68735 (2013.01); H01L 22/12 (2013.01); H01L 22/20 (2013.01); H01L 23/544 (2013.01); H01L 24/74 (2013.01); H01L 21/68 (2013.01); H01L 2223/54426 (2013.01); H01L 2224/8013 (2013.01); H01L 2224/80095 (2013.01); H01L 2224/80895 (2013.01);
Abstract
A substrate bonding apparatus that brings a part of a surface of a first substrate and a part of a surface of a second substrate into contact to form contact regions at the parts, and then enlarges the contact regions to bond the first substrate and the second substrate includes: a temperature adjusting unit that adjusts a temperature of at least one of the first substrate and the second substrate such that positional misalignment between the first substrate and the second substrate does not exceed a threshold at least in a course of enlargement of the contact regions.