The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 24, 2019
Filed:
Jun. 17, 2015
Applicant:
The Boeing Company, Chicago, IL (US);
Inventors:
John R. Hull, Sammamish, WA (US);
Robert J. Miller, Fall City, WA (US);
Assignee:
The Boeing Company, Chicago, IL (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01N 27/72 (2006.01); B23B 5/26 (2006.01); B23B 7/12 (2006.01); B23B 27/06 (2006.01); B23B 27/08 (2006.01); B23B 27/12 (2006.01); G01N 1/00 (2006.01); B32B 7/12 (2006.01); B32B 27/06 (2006.01); B32B 5/26 (2006.01); B32B 27/08 (2006.01); B32B 27/12 (2006.01);
U.S. Cl.
CPC ...
G01N 27/72 (2013.01); B32B 5/26 (2013.01); B32B 7/12 (2013.01); B32B 27/06 (2013.01); B32B 27/08 (2013.01); B32B 27/12 (2013.01); G01N 1/00 (2013.01); G01N 27/725 (2013.01); B32B 2307/50 (2013.01);
Abstract
A tester for bonded composite materials uses a magnetic source to generate a response signal from wires infused in an adhesive used between layers of the composite material. Acoustic or magnetic response signals, separately or in combination, can be received and analyzed to detect stresses in wires indicative of voids in the adhesive or other defects affecting the bond quality between layers of the composite material.