The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 24, 2019
Filed:
Oct. 02, 2017
Applicant:
United States Gypsum Company, Chicago, IL (US);
Inventors:
David D. Pelot, Chicago, IL (US);
William J. Rago, Gurnee, IL (US);
Charles W. Cochran, Elkhorn, WI (US);
Samar Emami, Chicago, IL (US);
Assignee:
UNITED STATES GYPSUM COMPANY, Chicago, IL (US);
Primary Examiner:
Int. Cl.
CPC ...
E04F 21/02 (2006.01); E04F 21/165 (2006.01); B44C 7/04 (2006.01); E04F 21/05 (2006.01); B65H 35/00 (2006.01); B44C 7/06 (2006.01);
U.S. Cl.
CPC ...
E04F 21/026 (2013.01); B44C 7/04 (2013.01); E04F 21/05 (2013.01); E04F 21/165 (2013.01); E04F 21/1652 (2013.01); E04F 21/1657 (2013.01); B44C 7/06 (2013.01); B65H 35/0053 (2013.01); Y10T 156/1788 (2015.01);
Abstract
A joint tape embedding apparatus configured to determine the bonding and/or 'feel' of embedding joint tape into a dry wall or wall board joint using a particular joint compound. The joint embedding apparatus is configured to allow the same user or different users to accurately repeat the determination of the bonding and/or 'feel' attributes of the joint compound.