The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 24, 2019

Filed:

Mar. 11, 2015
Applicants:

Thk Co., Ltd., Tokyo, JP;

Denki Kogyo Company, Limited, Tokyo, JP;

Inventors:

Junzo Shimbe, Tokyo, JP;

Hiroshi Nakabayashi, Tokyo, JP;

Takayuki Sakanoue, Tokyo, JP;

Kazuki Yoshiya, Tokyo, JP;

Hiroyuki Kai, Tokyo, JP;

Shuji Masubuchi, Tokyo, JP;

Makoto Nagata, Tokyo, JP;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C21D 9/40 (2006.01); H05B 6/42 (2006.01); H05B 6/44 (2006.01); H05B 6/10 (2006.01); C21D 1/42 (2006.01); C21D 1/667 (2006.01); C21D 9/00 (2006.01); H05B 6/36 (2006.01);
U.S. Cl.
CPC ...
C21D 9/40 (2013.01); C21D 1/42 (2013.01); C21D 1/667 (2013.01); C21D 9/0062 (2013.01); H05B 6/101 (2013.01); H05B 6/109 (2013.01); H05B 6/36 (2013.01); H05B 6/42 (2013.01); H05B 6/44 (2013.01); Y02P 10/253 (2015.11);
Abstract

A heat-treatment deviceincludes a tableon which a ring-shaped workpiece W can be placed, and a pair of heat processing unitsfor heat-processing the peripheral surface of the workpiece W. The heat-treatment deviceis used for obtaining the workpiece W having desired properties by the heat-processing the workpiece W while the pair of heat processing unitsmove in opposite directions along the peripheral surface of the workpiece W. The heat-treatment deviceis configured in such a way that a pair of revolving armsmovable relative to the tableoscillate the pair of heat processing unitsrelative to the workpiece W, thereby heat-processing the peripheral surface of the workpiece W. By adopting such a configuration, it is possible to obtain a heat-treatment device heat-processing the entire circumference of a ring-shaped workpiece.


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