IDiyas

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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10421840 B1

PDFFull Text
Date of Patent:
Sep. 24, 2019

Filed:

Jun. 13, 2017

Silicone-modified polyimide resin composition of solvent free type

Applicant:

Shin-etsu Chemical Co., Ltd., Tokyo, JP;

Inventors:

Hatsuhiko Hattori, Annaka, JP;

Yoshinori Yoneda, Tokyo, JP;

Tomoya Kanai, Annaka, JP;

Assignee:

SHIN-ETSU CHEMICAL CO., LTD., Tokyo, JP;

Attorney:

Birch, Stewart, Kolasch & Birch, LLP

Primary Examiner:

Michael M Dollinger

Int. Cl.
CPC ...
C08G 77/455 (2006.01); C09D 7/61 (2018.01); C09D 7/47 (2018.01); C08K 3/36 (2006.01); C09D 183/10 (2006.01); C09J 11/04 (2006.01); C09J 183/10 (2006.01); C08F 236/20 (2006.01); C08G 73/10 (2006.01); C08L 51/08 (2006.01); C08G 77/12 (2006.01); C08G 77/20 (2006.01);
U.S. Cl.
CPC ...
C08G 77/455 (2013.01); C08F 236/20 (2013.01); C08G 73/106 (2013.01); C08G 73/1042 (2013.01); C08G 73/1075 (2013.01); C08K 3/36 (2013.01); C08L 51/085 (2013.01); C09D 7/47 (2018.01); C09D 7/61 (2018.01); C09D 183/10 (2013.01); C09J 11/04 (2013.01); C09J 183/10 (2013.01); C08G 77/12 (2013.01); C08G 77/20 (2013.01);
Abstract

Disclosed herein is a silicone-modified polyimide resin composition of solvent free type. The composition is suitable for use as an adhesive and a coating material which are capable of hardening upon irradiation with ultraviolet rays and/or visible rays. Also, it is saved from drooling even in the case of light filling with an inorganic compound and it is saved from bubble entrapment and nonuniformity at the time of application with heavy filling. It further exhibits good moldability due to its thixotropic properties. Moreover, it exhibits improved adhesion to polyolefin resins without impairing the past properties. Finally, it gives rise to a cured product which is not excessively hard, with a low elastic modulus, despite filling with an inorganic compound. The composition of the present invention includes components (A) to (B) listed below and is characterized by being fluid at 25° C. and free of solvent:

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