The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 24, 2019

Filed:

Jun. 07, 2018
Applicant:

Toyota Boshoku Kabushiki Kaisha, Aichi, JP;

Inventor:

Kazuyuki Hirata, Toyota, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B21D 45/04 (2006.01); B26D 7/32 (2006.01); B26D 7/18 (2006.01); B21D 45/10 (2006.01); B26F 1/40 (2006.01);
U.S. Cl.
CPC ...
B21D 45/04 (2013.01); B21D 45/10 (2013.01); B26D 7/18 (2013.01); B26D 7/32 (2013.01); B26F 1/40 (2013.01); Y10T 83/9423 (2015.04);
Abstract

A workpiece manufacturing apparatus includes a lower die assembly, an upper die assembly, a workpiece extracting device, and a workpiece conveying device. The lower die assembly includes a punch configured to punch out a workpiece into the upper die assembly. The upper die assembly includes an ejector configured to eject the punched out workpiece. The extracting device includes a catch plate configured to receive the ejected workpiece and a moving mechanism, which moves the catch plate between positions below the upper die assembly and the conveying device. The moving mechanism is configured to move the catch plate from the conveying device to the positions below the upper die assembly as the upper die assembly moves upward and to move the catch plate from the positions below the upper die assembly to the conveying device as the upper die assembly moves downward.


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