The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 17, 2019

Filed:

Nov. 21, 2014
Applicant:

Ushio Denki Kabushiki Kaisha, Tokyo, JP;

Inventors:

Kenichi Hirose, Tokyo, JP;

Makoto Wasamoto, Tokyo, JP;

Shinichi Endo, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/00 (2006.01); H05K 3/28 (2006.01); B32B 3/26 (2006.01); B32B 27/06 (2006.01); C09D 133/02 (2006.01); C09D 163/00 (2006.01); B32B 15/08 (2006.01); B32B 15/20 (2006.01); B32B 27/08 (2006.01); B32B 27/28 (2006.01); B32B 27/30 (2006.01); B32B 27/32 (2006.01); B32B 27/36 (2006.01); B32B 27/38 (2006.01); B32B 27/40 (2006.01);
U.S. Cl.
CPC ...
H05K 3/0055 (2013.01); B32B 3/266 (2013.01); B32B 15/08 (2013.01); B32B 15/20 (2013.01); B32B 27/06 (2013.01); B32B 27/08 (2013.01); B32B 27/28 (2013.01); B32B 27/281 (2013.01); B32B 27/30 (2013.01); B32B 27/308 (2013.01); B32B 27/32 (2013.01); B32B 27/36 (2013.01); B32B 27/38 (2013.01); B32B 27/40 (2013.01); C09D 133/02 (2013.01); C09D 163/00 (2013.01); H05K 3/0026 (2013.01); H05K 3/0035 (2013.01); H05K 3/28 (2013.01); B32B 2255/10 (2013.01); B32B 2255/26 (2013.01); B32B 2264/102 (2013.01); B32B 2264/104 (2013.01); B32B 2307/202 (2013.01); B32B 2307/206 (2013.01); B32B 2307/418 (2013.01); B32B 2307/538 (2013.01); B32B 2307/732 (2013.01); B32B 2457/08 (2013.01); H05K 2203/0285 (2013.01); H05K 2203/095 (2013.01); H05K 2203/308 (2013.01);
Abstract

A desmear treatment method for a wiring board material is provide that is capable of performing desmear treating on the interior of a through hole formed in an insulating layer without requiring complicated steps and obtaining an insulating layer having appropriate surface roughness. The desmear treatment method comprises forming a hole passing through an insulating layer, wherein the insulating layer is made of a resin containing a filler, and desmear treating the wiring board material with radicals. The wiring board material includes a depletable resist layer formed on the insulating layer, and the depletable resist layer is made of a resin to be depleted in the desmear treatment step. A method of manufacturing a wiring board material to be subjected to the desmear treatment method and a composite insulating layer forming material used in the manufacturing method are also disclosed.


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