The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 17, 2019

Filed:

Aug. 30, 2018
Applicants:

Hong Fu Jin Precision Industry (Wuhan) Co., Ltd., Wuhan, CN;

Hon Hai Precision Industry Co., Ltd., New Taipei, TW;

Inventor:

Jian-Cai Chen, Wuhan, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 1/11 (2006.01); H01R 12/71 (2011.01);
U.S. Cl.
CPC ...
H05K 1/181 (2013.01); H01R 12/712 (2013.01); H05K 1/111 (2013.01); H05K 2201/10022 (2013.01); H05K 2201/10189 (2013.01);
Abstract

A printed circuit board (PCB) able to accommodate different types of interconnection slots without an increase in size includes a mounting area which accommodates some individual conductive pads and some conductive sharing pads. When a first type connector is mounted on the PCB, the data pins of the first type connector correspond to the sharing pads and when a second type connector is mounted on the PCB, the data pins of the second type connector correspond to the individual pads and the sharing pads.


Find Patent Forward Citations

Chen, Jian-Cai. (2019). Printed circuit board adaptable for multiple interconnection slots (U.S. Patent No. 10420219). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10420219

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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