The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 17, 2019
Filed:
Jul. 09, 2018
Applicant:
Fujitsu Limited, Kawasaki-shi, Kanagawa, JP;
Inventor:
Keiichi Yamamoto, Yokohama, JP;
Assignee:
FUJITSU LIMITED, Kawasaki, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 3/40 (2006.01); H05K 3/34 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 21/48 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/111 (2013.01); H01L 21/4853 (2013.01); H01L 23/49811 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H05K 1/0271 (2013.01); H05K 1/119 (2013.01); H05K 1/181 (2013.01); H05K 3/3494 (2013.01); H05K 3/4007 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16237 (2013.01); H01L 2224/81815 (2013.01); H01L 2924/3511 (2013.01); H01L 2924/3841 (2013.01); H05K 3/3436 (2013.01); H05K 2201/09136 (2013.01); H05K 2201/09418 (2013.01); H05K 2201/09845 (2013.01); H05K 2201/09909 (2013.01); H05K 2201/10734 (2013.01);
Abstract
A wiring board includes a substrate, an electrode on a surface of the substrate, a wall surface in a ring shape surrounding an outer circumference of the electrode, an upper end of the wall surface is located at a position higher than a surface of the electrode, and a protrusion at the upper end of the wall surface, the protrusion protruding with respect to the wall surface inward of a ring shape defined by the wall surface.