The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 17, 2019
Filed:
Sep. 06, 2017
Applicant:
Microsoft Technology Licensing, Llc, Redmond, WA (US);
Inventors:
Jonathan Bernard Lester, Bellevue, WA (US);
Bhret Robert Graydon, San Jose, CA (US);
Matthew David Mickelson, Seattle, WA (US);
Lauren Akemi Hamamoto Donegan Ryan, Kirkland, WA (US);
Assignee:
MICROSOFT TECHNOLOGY LICENSING, LLC, Redmond, WA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0298 (2013.01); H05K 1/028 (2013.01); H05K 1/0216 (2013.01); H05K 1/0281 (2013.01); H05K 1/0306 (2013.01); H05K 1/115 (2013.01); H05K 1/189 (2013.01); H05K 3/4691 (2013.01); H05K 2201/09781 (2013.01);
Abstract
A printed circuit board is provided. The printed circuit board includes a flexible region. The flexible region includes a first copper layer, a first dielectric layer, a second copper layer, an adhesive layer, and a first metal layer, in the order listed. The first metal layer includes a metal film having a tensile strength greater than the first and second copper layers and greater than the dielectric layer.