The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 17, 2019

Filed:

Oct. 20, 2016
Applicant:

Seiko Epson Corporation, Tokyo, JP;

Inventors:

Atsushi Matsuo, Okaya, JP;

Takayuki Kikuchi, Chino, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B81C 1/00 (2006.01); H03H 9/215 (2006.01); H01L 21/308 (2006.01); H01L 41/04 (2006.01); H03H 3/02 (2006.01); H03H 9/05 (2006.01); H03H 9/17 (2006.01); H03H 9/21 (2006.01);
U.S. Cl.
CPC ...
H03H 9/215 (2013.01); H03H 3/02 (2013.01); H03H 9/05 (2013.01); H03H 9/0595 (2013.01); H03H 9/17 (2013.01); H03H 9/21 (2013.01); H03H 2003/026 (2013.01);
Abstract

An electronic component manufacturing method, in which a notch and a concave portion are formed in a substrate, includes forming an etching mask in which a maximum width of a first mask portion which forms a width between two side surfaces of the concave portion along a longitudinal direction, when the substrate is seen in a plan view from a direction perpendicular to a surface of the substrate having the concave portion formed therein, is smaller than a width of a second mask portion which forms a minimum width of an opening of the notch, and forming the notch and the concave portion by performing dry etching processing on the substrate.


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