The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 17, 2019

Filed:

Jul. 29, 2015
Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Yuichiro Sadanaga, Osaka, JP;

Kenji Kondo, Nara, JP;

Takeshi Sakata, Osaka, JP;

Masanori Morita, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H02K 5/08 (2006.01); F16L 59/02 (2006.01); H02K 5/04 (2006.01); H02K 11/00 (2016.01); H02K 11/33 (2016.01); B29C 69/02 (2006.01); H05K 7/20 (2006.01); B29K 81/00 (2006.01); B29L 31/00 (2006.01);
U.S. Cl.
CPC ...
H02K 5/08 (2013.01); B29C 69/02 (2013.01); F16L 59/02 (2013.01); H02K 5/04 (2013.01); H02K 11/00 (2013.01); H02K 11/33 (2016.01); B29K 2081/04 (2013.01); B29K 2995/0015 (2013.01); B29L 2031/749 (2013.01); H02K 2211/03 (2013.01); H05K 7/20 (2013.01);
Abstract

A thermal insulation structure for an electronic device of the present invention is a thermal insulation structure which thermally insulates between an electronic circuit unit and a heat generator formed with another component. In the thermal insulation structure, a partition wall for separating each space and formed of resin having electric insulation properties is provided between the electronic circuit unit and the heat generator. Also, the partition wall is formed by integrating the resin and a thermal insulation material having thermal conductivity lower than thermal conductivity of air so that the resin includes the thermal insulation material. Further, the partition wall is formed by insert-molding the thermal insulation material with the resin. Further, the resin having the electric insulation properties is thermoplastic resin, and a thermal insulation raw material of the thermal insulation material is silica xerogel.


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