The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 17, 2019

Filed:

Jun. 25, 2018
Applicant:

National Chiao Tung University, Hsinchu, TW;

Inventors:

Jenn-Hwan Tarng, Hsinchu, TW;

Chi-Yang Chang, Taipei, TW;

Che-Hao Chang, New Taipei, TW;

Jing-Cheng Hong, Chiayi, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 1/48 (2006.01); H01Q 21/00 (2006.01); H01Q 1/24 (2006.01); H01Q 21/30 (2006.01);
U.S. Cl.
CPC ...
H01Q 21/0075 (2013.01); H01Q 1/243 (2013.01); H01Q 1/48 (2013.01); H01Q 21/30 (2013.01);
Abstract

A signal line conversion structure of the antenna array is disposed between the antenna array and the circuit substrate, which includes a first dielectric substrate is disposed on the circuit substrate, a second dielectric substrate is vertically disposed on the first dielectric substrate and divided into a first region and a second region, and the second dielectric substrate is provided with the antenna array. At least one signal line is disposed on the first region and extends to the second dielectric substrate for connecting the circuit substrate and the antenna array. A metal connecting plate has at least three metal through holes pierced in the first dielectric substrate and connected to the second ground layer. The metal connecting plate is connected to the first ground layer of the first dielectric substrate and the second ground layer of the second dielectric substrate through the metal through holes.


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