The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 17, 2019

Filed:

Apr. 25, 2019
Applicant:

Xuyu Optoelectronics (Shenzhen) Co., Ltd., Shenzhen, CN;

Inventors:

Jintian Lin, Shenzhen, CN;

Xiaobing Cao, Shenzhen, CN;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/64 (2010.01); H01L 33/50 (2010.01); H01L 33/60 (2010.01); H01L 33/58 (2010.01);
U.S. Cl.
CPC ...
H01L 33/642 (2013.01); H01L 33/505 (2013.01); H01L 33/507 (2013.01); H01L 33/58 (2013.01); H01L 33/60 (2013.01); H01L 33/641 (2013.01);
Abstract

High-power remote phosphor white LED heat-dissipation package relates to an LED heat-dissipation package, for solving the problem of poor heat dissipation of LED package structures. The substrate of the package structure is provided with a boss and a heat conducting ring, and the phosphor structural layer contains hollow glass microspheres. The white LED heat-dissipation package structure in the present invention improves the spatial chroma uniformity of the white light by using the hollow glass microspheres, thereby reducing the costs. The package structure can improve the heat dissipation efficiency of the chip and the utilization ratio of light emitted from the chip. The present invention is applicable to prepare high-power remote phosphor white LEDs.


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