The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 17, 2019
Filed:
Aug. 22, 2016
Applicant:
Hitachi Chemical Co., Ltd., Tokyo, JP;
Inventors:
Brian E. Hardin, San Carlos, CA (US);
Stephen T. Connor, San Francisco, CA (US);
James Randy Groves, Sunnyvale, CA (US);
Craig H. Peters, Belmont, CA (US);
Assignee:
Hitachi Chemical Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/00 (2006.01); H01L 31/0224 (2006.01); H01B 1/22 (2006.01);
U.S. Cl.
CPC ...
H01L 31/022425 (2013.01); H01B 1/22 (2013.01); Y02E 10/50 (2013.01);
Abstract
Metallization pastes for use with semiconductor devices are disclosed. The pastes contain silver particles, low-melting-point base-metal particles, organic vehicle, and optional crystallizing agents. Specific formulations have been developed that produce stratified metal films that contain less silver than conventional pastes and that have high peel strengths. Such pastes can be used to make high contact resistance metallization layers on silicon.