The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 17, 2019

Filed:

Sep. 13, 2018
Applicant:

Korea Advanced Nano Fab Center, Gyeonggi-do, KR;

Inventors:

Kyungho Park, Gyeonggi-do, KR;

Chuyoung Cho, Gyeonggi-do, KR;

Hyeong Ho Park, Daejeon, KR;

Yu Min Koh, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 31/02 (2006.01); H01L 31/18 (2006.01); H01L 29/778 (2006.01); H01L 29/66 (2006.01); G01N 27/12 (2006.01); G01N 27/414 (2006.01); G01N 33/00 (2006.01); H01L 31/0224 (2006.01); H01L 31/0304 (2006.01);
U.S. Cl.
CPC ...
H01L 31/02024 (2013.01); G01N 27/124 (2013.01); G01N 27/128 (2013.01); G01N 27/4141 (2013.01); G01N 33/005 (2013.01); H01L 29/66431 (2013.01); H01L 29/778 (2013.01); H01L 31/0224 (2013.01); H01L 31/03046 (2013.01); H01L 31/1852 (2013.01); G01N 27/129 (2013.01);
Abstract

A gallium nitride-based sensor having a heater structure and a method of manufacturing the same are disclosed, the method including growing an n-type or p-type GaN layer on a substrate, growing a barrier layer on the n-type or p-type GaN layer, sequentially growing a u-GaN layer and a layer selected from among an AlGaN layer, an InAlN layer and an InAlGaN layer on the barrier layer, patterning the n-type or p-type GaN layer to form an electrode, forming the electrode along the pattern formed on the n-type or p-type GaN layer, and forming a sensing material layer on the layer selected from among the AlGaN layer, the InAlN layer and the InAlGaN layer, wherein a HEMT sensor or a Schottky diode sensor can be heated using an n-GaN (or p-GaN) layer, thus increasing the sensitivity of the sensor and reducing the restoration time.


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